Advanced MEMS Packaging

by: John H. Lau, Chengkuo Lee, C. S. Premachandran, Yu Aibin


Abstract: A comprehensive guide to advanced MEMS packaging methods. This book presents the latest and cutting-edge MEMS (Microelectromechanical systems) packaging techniques such as low-temperature bonding and 3D packaging. Written by experts in the field, Advanced MEMS Packaging serves as a valuable reference for those faced with the challenging problems created by the ever-increasing interests in MEMS devices and packaging. This authoritative guide is ideal for anyone who needs to choose a reliable, creative, high-performance, robust, and cost-effective packaging technique for MEMS devices. The book will also aid in stimulating further research and development in optical, electrical, and thermal designs as well as materials, process, manufacturing, testing, and reliability
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Book Details

Title: Advanced MEMS Packaging

Publisher: : New York, Chicago, San Francisco, Lisbon, London, Madrid, Mexico City, Milan, New Delhi, San Juan, Seoul, Singapore, Sydney, Toronto

Copyright / Pub. Date: 2010 The McGraw-Hill Companies, Inc.

ISBN: 9780071626231

Authors:

John H. Lau , Ph.D., P.E., IEEE Fellow, ASME Fellow is a senior engineer in the microsystems, modules, and components laboratory at the Institute of Microelectronics(IME) in Singapore.

Chengkuo Lee is the author of this McGraw-Hill Professional publication.

C. S. Premachandran is the author of this McGraw-Hill Professional publication.

Yu Aibin is at the Institute of Microelectronics in Singapore.

Description: A comprehensive guide to advanced MEMS packaging methods. This book presents the latest and cutting-edge MEMS (Microelectromechanical systems) packaging techniques such as low-temperature bonding and 3D packaging. Written by experts in the field, Advanced MEMS Packaging serves as a valuable reference for those faced with the challenging problems created by the ever-increasing interests in MEMS devices and packaging. This authoritative guide is ideal for anyone who needs to choose a reliable, creative, high-performance, robust, and cost-effective packaging technique for MEMS devices. The book will also aid in stimulating further research and development in optical, electrical, and thermal designs as well as materials, process, manufacturing, testing, and reliability