Advanced Packaging of RF MEMS Devices


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Advanced Packaging of RF MEMS Devices
Advanced Packaging of RF MEMS Devices
<emphasis role="bold">Introduction</emphasis> Similar to IC packaging, packaging of radiofrequency (RF) MEMS devices must provide environmental protection, an electrical signal path, mechanical support, thermal dissipation and have a low parasitic capacity in the chip-substrate interconnection with low insertion loss and minimal interference. Packaging of RF MEMS devices should also prevent moisture and particulates, which may impair the movement of freestanding MEMS structures. Therefore RF MEMS devices must be packaged using hermetic or near-hermetic seals with certain vacuum le…
Citation
John H. Lau; Chengkuo Lee; C. S. Premachandran; Yu Aibin: Advanced MEMS Packaging. Advanced Packaging of RF MEMS Devices, Chapter (McGraw-Hill Professional, 2010), AccessEngineering Export