Area Array Packaging Handbook: Manufacturing and Assembly

by: Ken Gilleo, Jan Vardaman


Abstract: Covers design, packaging, construction, assembly, and application of all three approaches to Area Array Packaging: Ball Grid Array (BGA), Chip Scale Package (CSP), and Flip Chip (FC). Details the pros and cons of each technology with varying applications. Examines packaging ramifications of high density interconnects (HDI)
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Book Details

Title: Area Array Packaging Handbook: Manufacturing and Assembly

Publisher: McGraw-Hill: New York, Chicago, San Francisco, Lisbon, London, Madrid, Mexico City, Milan, New Delhi, San Juan, Seoul, Singapore, Sydney, Toronto

Copyright / Pub. Date: 2002 The McGraw-Hill Companies, Inc.

ISBN: 9780071374934

Authors:

Ken Gilleo Ph.D., General Technologist for Cookson Electronics, is a widely respected expert on microelectronics packaging. The author of Handbook of Flexible Circuitry and Polymer Thick Film, as well as over 260 professional journal articles on packaging, circuitry, and materials, he holds 35 U.S. patents and currently serves on the board of directors of the SMTA (Surface Mount Technology Association).

Jan Vardaman is the author of this McGraw-Hill Professional publication.

Description: Covers design, packaging, construction, assembly, and application of all three approaches to Area Array Packaging: Ball Grid Array (BGA), Chip Scale Package (CSP), and Flip Chip (FC). Details the pros and cons of each technology with varying applications. Examines packaging ramifications of high density interconnects (HDI)