Materials and Processes for Hybrid Microelectronics and Multichip Modules


Please sign in to view the rest of this entry.

Materials and Processes for Hybrid Microelectronics and Multichip Modules
Dr. Jerry E. Sergent School of Engineering Fairfield University Fairfield, Connecticut 1010604Materials and Processes for Hybrid Microelectronics and Multichip Modules
<emphasis role="bold">Introduction</emphasis> Hybrid microel…
Citation
Charles A. Harper: Electronic Materials and Processes Handbook, Third Edition. Materials and Processes for Hybrid Microelectronics and Multichip Modules, Chapter (McGraw-Hill Professional, 2004 1994 1970), AccessEngineering Export