Introduction


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Introduction
IntroductionFailure analysis of electronic systems presents certain unique challenges due to the small size of their components and the complexity of their construction. Failures of electronic components may involve conventional mechanical fracture, the mechanisms and modes of which are described in previous chapters. However, there are unique electrical phenomena involved in their failure which are not encountered in exclusively mechanical systems that must also be considered, e.g., arcing and electromigration. In addition, the small size of many of the electronic components produces microstructural effects that may play a role in failure. For example, the fine wires for connectors may have a grain size comparable to that of the dimensions of the wire, thereby making the wires susceptible to low ductilit…
Citation
Charlie R. Brooks; Ashok Choudhury: Failure Analysis of Engineering Materials. Introduction, Chapter (McGraw-Hill Professional, 2002), AccessEngineering Export