Fundamentals of Microsystems Packaging

by: Rao R. Tummala


Abstract: A rigorous and thorough introduction to electronic packaging technologies. Each chapter covers a single major packaging technology illustrated with schematics and diagrams. Aspects of electrical, mechanical, chemical, and materials packaging are identified in each chapter
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Book Details

Title: Fundamentals of Microsystems Packaging

Publisher: McGRAW-HILL: New York, Chicago, San Francisco, Lisbon, London, Madrid, Mexico City, Milan, New Delhi, San Juan, Seoul, Singapore, Sydney, Toronto

Copyright / Pub. Date: 2001 The McGraw-Hill Companies, Inc

ISBN: 9780071371698

Authors:

Rao R. Tummala is the author of this McGraw-Hill Professional publication.

Description: A rigorous and thorough introduction to electronic packaging technologies. Each chapter covers a single major packaging technology illustrated with schematics and diagrams. Aspects of electrical, mechanical, chemical, and materials packaging are identified in each chapter