Microchip Fabrication: A Practical Guide to Semiconductor Processing, Fifth Edition
by: Peter Van Zant
Abstract: The #1 book in the industry for more than 15 years! Utilizing a straightforward, math-free pathology, this is a novice-friendly guide to the semiconductor fabrication process from raw materials through shipping the finished, packaged device. Challenging quizzes and review summaries make this the perfect learning guide for technicians in training. NEW chapter on nanotechnology. NEW sections on 300mm wafer processing. Processes and devices, and Green processing. Every chapter updated to reflect the latest processing techniques.
Full details
Table of Contents
- A. Preface to the Fifth Edition
- 1. The Semiconductor Industry
- 2. Properties of Semiconductor Materials and Chemicals
- 3. Crystal Growth and Silicon Wafer Preparation
- 4. Overview of Wafer Fabrication
- 5. Contamination Control
- 6. Productivity and Process Yields
- 7. Oxidation
- 8. The Ten-Step Patterning Process—Surface Preparation to Exposure
- 9. The Ten-Step Patterning Process—Developing to Final Inspection
- 10. Advanced Photolithography Processes
- 11. Doping
- 12. Layer Deposition
- 13. Metallization
- 14. Process and Device Evaluation
- 15. The Business of Wafer Fabrication
- 16. Introduction to Devices and Integrated Circuit Formation
- 17. Introduction to Integrated Circuits
- 18. Packaging
- A. Glossary
Tools & Media
Expanded Table of Contents
-
A.
Preface to the Fifth Edition
- 1. The Semiconductor Industry
-
2.
Properties of Semiconductor Materials and Chemicals
- Overview
- Objectives
- Atomic Structure
- The Periodic Table of the Elements
- Electrical Conduction
- Dielectrics and Capacitors
- Intrinsic Semiconductors
- Doped Semiconductors
- Electron and Hole Conduction
- Semiconductor Production Materials
- Semiconducting Compounds
- Silicon Germanium
- Engineered Substrates
- Ferroelectric Materials
- Diamond Semiconductors
- Process Chemicals
- States of Matter
- Properties of Matter
- Pressure and Vacuum
- Acids, Alkalis, and Solvents
- Chemical Purity and Cleanliness
- Review Questions
-
3.
Crystal Growth and Silicon Wafer Preparation
- Overview
- Objectives
- Introduction
- Semiconductor Silicon Preparation
- Crystalline Materials
- Crystal Orientation
- Crystal Growth
- Crystal and Wafer Quality
- Wafer Preparation
- Wafer Slicing
- Wafer Marking
- Rough Polish
- Chemical Mechanical Polishing (CMP)
- Backside Processing
- Double-Sided Polishing
- Edge Grinding and Polishing
- Wafer Evaluation
- Oxidation
- Packaging
- Engineered Wafers (Substrates)
- Review Questions
- 4. Overview of Wafer Fabrication
- 5. Contamination Control
- 6. Productivity and Process Yields
- 7. Oxidation
-
8.
The Ten-Step Patterning Process—Surface Preparation to Exposure
- Overview
- Objectives
- Introduction
- Overview of the Photomasking Process
- Ten-Step Process
- Basic Photoresist Chemistry
- Photoresist Performance Factors
- Physical Properties of Photoresists
- Photomasking Processes
- Surface Preparation
- Photoresist Application (Spinning)
- Soft Bake
- Alignment and Exposure
- Advanced Lithography
- Review Questions
- 9. The Ten-Step Patterning Process—Developing to Final Inspection
- 10. Advanced Photolithography Processes
-
11.
Doping
- Overview
- Objectives
- Introduction
- Formation of a Doped Region by Diffusion
- Formation of a Doped Region and Junction by Diffusion
- Diffusion Process Steps
- Deposition
- Drive-in Oxidation
- Introduction to Ion Implantation
- Concept of Ion Implantation
- Ion Implantation System
- Dopant Concentration in Implanted Regions
- Evaluation of Implanted Layers
- Uses of Ion Implantation
- The Future of Doping
- Review Questions
-
12.
Layer Deposition
- Overview
- Objectives
- Introduction
- Chemical Vapor Deposition Basics
- CVD Process Steps
- CVD System Types
- Atmospheric-Pressure CVD Systems
- Low-Pressure Chemical Vapor Deposition (LPCVD)
- Atomic Layer Deposition (ALD)
- Vapor Phase Epitaxy (VPE)
- Molecular Beam Epitaxy (MBE)
- Metalorganic CVD (MOCVD)
- Deposited Films
- Deposited Semiconductors
- Epitaxial Silicon
- Polysilicon and Amorphous Silicon Deposition
- SOS and SOI
- Gallium Arsenide on Silicon
- Insulators and Dielectrics
- Conductors
- Review Questions
- 13. Metallization
-
14.
Process and Device Evaluation
- Overview
- Objectives
- Introduction
- Wafer Electrical Measurements
- Process and Device Evaluation
- Physical Measurement Methods
- Layer Thickness Measurements
- Junction Depth
- Contamination and Defect Detection
- General Surface Characterization
- Contamination Identification
- Device Electrical Measurements
- Review Questions
- 15. The Business of Wafer Fabrication
- 16. Introduction to Devices and Integrated Circuit Formation
- 17. Introduction to Integrated Circuits
- 18. Packaging
-
A.
Glossary
Book Details
Title: Microchip Fabrication: A Practical Guide to Semiconductor Processing, Fifth Edition
Publisher: McGraw-Hill: New York, Chicago, San Francisco, Lisbon, London, Madrid, Mexico City, Milan, New Delhi, San Juan Seoul, Singapore, Sydney, Toronto
Copyright / Pub. Date: 2004, 2000, 1997, 1984 The McGraw-Hill Companies, Inc
ISBN: 9780071432412
Authors:
Peter Van Zant
is an internationally known semiconductor professional with an extensive background
in process engineering, training, consulting, and writing. Principal of Peter Van
Zant Associates, a firm that supplies writing, training, and consulting services to
business and industry, he is the author of Semiconductor Technology Glossary, Third
Edition; Integrated Circuits Text; Safety First Manual; and Chip Packaging Manual.
His books and training materials are used by chip manufacturers, industry suppliers,
colleges, and universities. Peter Van Zant Associates’ customers include Intel, National
Semiconductor, Applied Materials, Air Products and Chemicals, SCP Global Inc., and
a number of educational institutions. Mr. Van Zant is also the elected District 1
Supervisor in his home county of Nevada in California.
Description: The #1 book in the industry for more than 15 years! Utilizing a straightforward, math-free pathology, this is a novice-friendly guide to the semiconductor fabrication process from raw materials through shipping the finished, packaged device. Challenging quizzes and review summaries make this the perfect learning guide for technicians in training. NEW chapter on nanotechnology. NEW sections on 300mm wafer processing. Processes and devices, and Green processing. Every chapter updated to reflect the latest processing techniques.
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