Microvias: For Low Cost, High Density Interconnects
by: John H. Lau
Abstract: The first-ever book on microvias, the new high-density interconnect technology changing the nature of printed circuit boards–and driving the mobile electronic revolution. A must for electronics and mechanical engineers, this intensive introduction covers microvia technology expertly surveys all major techniques: mechanical NC drilling, laser drilling, photo-defined, chemical etching, and conductive ink formation. Features a detailed survey of the work of leading companies–and their products–from around the globe.
Full details
Table of Contents
- A.
- B. Foreword
- C. Preface
- D. Acknowledgments
- 1. Introduction to Microvia and WLCSP Technologies
- 2. Conventional Printed Circuit Board Technologies
- 3. Microvias by Mechanical Drilling
- 4. Microvias by Laser Drilling
- 5. Microvias by Photoimaging
- 6. Microvias by Etching
- 7. Conductive Paste/Ink-Filled Microvias
- 8. Special High-Density Interconnects for Flip Chip Applications
- 9. Solders for Next-Generation High-Density Interconnects
- 10. Solder-Bumped Flip Chip WLCSP
- 11. Assembly of Flip Chip on PCB/Substrate
- 12. Solder Joint Reliability of Flip Chip on Microvia PCB/Substrate
- A. ABOUT THE AUTHORS
Tools & Media
Expanded Table of Contents
-
A.
-
B.
Foreword
-
C.
Preface
-
D.
Acknowledgments
- 1. Introduction to Microvia and WLCSP Technologies
- 2. Conventional Printed Circuit Board Technologies
- 3. Microvias by Mechanical Drilling
- 4. Microvias by Laser Drilling
- 5. Microvias by Photoimaging
- 6. Microvias by Etching
- 7. Conductive Paste/Ink-Filled Microvias
- 8. Special High-Density Interconnects for Flip Chip Applications
- 9. Solders for Next-Generation High-Density Interconnects
- 10. Solder-Bumped Flip Chip WLCSP
- 11. Assembly of Flip Chip on PCB/Substrate
-
12.
Solder Joint Reliability of Flip Chip on Microvia PCB/Substrate
- Introduction
- Elastic, Plastic, and Creep Analyses of WLCSP on Microvia PCB
- Lead-Free Solder-Bumped WLCSP on Microvia PCB
- Microvia PCB Thickness Effect on WLCSP Solder Joint Reliability 71
- Crack Propagation in Flip Chip Solder Joints
- Elastic Thermal Fatigue Life Prediction Model (ΔK)
- Plastic Thermal Fatigue Life Prediction (ΔJ)
- Creep Thermal Fatigue Life Prediction Model (ΔW)
- Solder Joint Reliability of Underfilled Flip Chip on Microvia PCB/Substrate
- Effects of Double-Side Microvia Build-Up Layers on WLCSP Solder Joint Reliability
-
A.
ABOUT THE AUTHORS
Book Details
Title: Microvias: For Low Cost, High Density Interconnects
Publisher: McGraw-Hill: New York, Chicago, San Francisco, Lisbon, London, Madrid, Mexico City, Milan, New Delhi, San Juan, Seoul, Singapore, Sydney, Toronto
Copyright / Pub. Date: 2001 The McGraw-Hill Companies, Inc.
ISBN: 9780071363273
Authors:
John H. Lau is the author of this McGraw-Hill Professional publication.
Description: The first-ever book on microvias, the new high-density interconnect technology changing the nature of printed circuit boards–and driving the mobile electronic revolution. A must for electronics and mechanical engineers, this intensive introduction covers microvia technology expertly surveys all major techniques: mechanical NC drilling, laser drilling, photo-defined, chemical etching, and conductive ink formation. Features a detailed survey of the work of leading companies–and their products–from around the globe.
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