ELECTRONIC PACKAGING AND HIGH-DENSITY INTERCONNECTIVITY


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ELECTRONIC PACKAGING AND HIGH-DENSITY INTERCONNECTIVITY
1010608ELECTRONIC PACKAGING AND HIGH-DENSITY INTERCONNECTIVITYAdapted from Coombs, Clyde F. Jr., Printed Circuits Handbook (4th ed.), chap. 1, “Electronic Packaging and Interconnectivity,” (McGraw-Hill, New York, 1996.)Clyde F. Coombs Jr.Editor-In-Chief, Los Altos, CaliforniaHappy T. HoldenWestwood Associates, Loveland, Colorado
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Citation
Clyde F. Coombs, Jr.: Printed Circuits Handbook, Sixth Edition. ELECTRONIC PACKAGING AND HIGH-DENSITY INTERCONNECTIVITY, Chapter (McGraw-Hill Professional, 2008), AccessEngineering Export