Chip-to-Wafer (C2W) Bonding and Lead-Free Interconnect Reliability


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Chip-to-Wafer (C2W) Bonding and Lead-Free Interconnect Reliability
1010608Chip-to-Wafer (C2W) Bonding and Lead-Free Interconnect Reliability
<emphasis role="bold">Introduction</emphasis> As mentioned in Chap. 1, face-to-face silicon chips stacking is one of the package-on-package (PoP) 3-D integrated circuit (IC) packaging technologies [
Citation
John H. Lau: Reliability of RoHS-Compliant 2D and 3D IC Interconnects. Chip-to-Wafer (C2W) Bonding and Lead-Free Interconnect Reliability, Chapter (McGraw-Hill Professional, 2011), AccessEngineering Export