Semiconductor Manufacturing Handbook
by: Hwaiyu Geng
Abstract: This handbook will provide engineers with the principles, applications, and solutions needed to design and manage semiconductor manufacturing operations. Consolidating the many complex fields of semiconductor fundamentals and manufacturing into one volume by deploying a team of world class specialists, it allows the quick look up of specific manufacturing reference data across many subdisciplines.
Full details
Table of Contents
- A. BOARD OF REVIEWERS
- B. PREFACE
- C. ACKNOWLEDGMENTS
- 1. HOW SEMICONDUCTOR CHIPS ARE MADE
- 2. IC DESIGN
- 3. SILICON SUBSTRATES FOR SEMICONDUCTOR MANUFACTURING
- 4. COPPER, LOW-κ DIELECTRICS, AND THEIR RELIABILITY
- 5. FUNDAMENTALS OF SILICIDE FORMATION ON Si
- 6. PLASMA PROCESS CONTROL
- 7. VACUUM TECHNOLOGY
- 8. PHOTOMASK
- 9. MICROLITHOGRAPHY
- 10. ION IMPLANTATION AND RAPID THERMAL PROCESSING
- 11. WET ETCHING
- 12. PLASMA ETCHING
- 13. PHYSICAL VAPOR DEPOSITION
- 14. CHEMICAL VAPOR DEPOSITION
- 15. EPITAXY
- 16. ECD FUNDAMENTALS
- 17. CHEMICAL MECHANICAL POLISHING
- 18. WET CLEANING
- 19. INSPECTION, MEASUREMENT, AND TEST
- 20. GRINDING, STRESS RELIEF, AND DICING
- 21. PACKAGING
- 22. NANOTECHNOLOGY AND NANOMANUFACTURING
- 23. FUNDAMENTALS OF MICROELECTROMECHANICAL SYSTEMS
- 24. FLAT-PANEL DISPLAY TECHNOLOGY AND MANUFACTURING
- 25. SPECIALTY GAS AND CDA SYSTEMS
- 26. WASTE GAS ABATEMENT SYSTEMS
- 27. PFC ABATEMENT
- 28. CHEMICAL AND SLURRY HANDLING SYSTEMS
- 29. FLUID HANDLING COMPONENTS FOR HIGH-PURITY LIQUID CHEMICALS AND SLURRIES
- 30. FUNDAMENTALS OF ULTRAPURE WATER
- 31. YIELD MANAGEMENT
- 32. AUTOMATED MATERIAL HANDLING SYSTEM
- 33. CD METROLOGY AND CD-SEM
- 34. SIX SIGMA
- 35. ADVANCED PROCESS CONTROL
- 36. ENVIRONMENTAL, HEALTH, AND SAFETY CONSIDERATIONS IN SEMICONDUCTOR FABRICATION FACILITIES
- 37. PLAN, DESIGN, AND CONSTRUCTION OF A FAB
- 38. CLEANROOM DESIGN AND CONSTRUCTION
- 39. MICRO-VIBRATION AND NOISE DESIGN
- 40. ESD CONTROLS IN CLEANROOM ENVIRONMENTS
- 41. AIRBORNE MOLECULAR CONTAMINATION
- 42. PARTICLE MONITORING IN SEMICONDUCTOR MANUFACTURING
- 43. WASTEWATER NEUTRALIZATION SYSTEMS
- A. APPENDIX
- B. ABOUT THE EDITOR
Tools & Media
Expanded Table of Contents
-
A.
BOARD OF REVIEWERS
-
B.
PREFACE
-
C.
ACKNOWLEDGMENTS
- 1. HOW SEMICONDUCTOR CHIPS ARE MADE
- 2. IC DESIGN
- 3. SILICON SUBSTRATES FOR SEMICONDUCTOR MANUFACTURING
- 4. COPPER, LOW-κ DIELECTRICS, AND THEIR RELIABILITY
- 5. FUNDAMENTALS OF SILICIDE FORMATION ON Si
- 6. PLASMA PROCESS CONTROL
- 7. VACUUM TECHNOLOGY
- 8. PHOTOMASK
- 9. MICROLITHOGRAPHY
- 10. ION IMPLANTATION AND RAPID THERMAL PROCESSING
- 11. WET ETCHING
- 12. PLASMA ETCHING
-
13.
PHYSICAL VAPOR DEPOSITION
- INTRODUCTION TO PHYSICAL VAPOR DEPOSITION
- FUNDAMENTALS OF PVD PROCESSES
- VACUUM EVAPORATION
- EVAPORATOR EQUIPMENT
- LAYERS DEPOSITED USING EVAPORATION AND THEIR PROPERTIES
- SPUTTERING
- SPUTTER EQUIPMENT
- LAYERS DEPOSITED USING SPUTTERING
- ATOMIC LAYER DEPOSITION—NEW PERSPECTIVES FOR THIN FILM DEPOSITION TECHNIQUES
- SUMMARY AND OUTLOOK
- 14. CHEMICAL VAPOR DEPOSITION
- 15. EPITAXY
- 16. ECD FUNDAMENTALS
- 17. CHEMICAL MECHANICAL POLISHING
- 18. WET CLEANING
-
19.
INSPECTION, MEASUREMENT, AND TEST
- INTRODUCTION—OVERVIEW ON TESTING EQUIPMENT
- FUNDAMENTALS OF TEST EQUIPMENT AND MANUFACTURING AUTOMATION SYSTEMS
- HOW TO PREPARE, PLAN, SPECIFY, SELECT VENDOR, AND PURCHASE TEST EQUIPMENT
- WHAT ARE OPERATION, SAFETY, CALIBRATION, AND MAINTENANCE CONSIDERATIONS?
- FUTURE TRENDS AND CONCLUSIONS
- ACKNOWLEDGMENT TO AUTHORS
- INFORMATION RESOURCES
- 20. GRINDING, STRESS RELIEF, AND DICING
- 21. PACKAGING
- 22. NANOTECHNOLOGY AND NANOMANUFACTURING
- 23. FUNDAMENTALS OF MICROELECTROMECHANICAL SYSTEMS
- 24. FLAT-PANEL DISPLAY TECHNOLOGY AND MANUFACTURING
- 25. SPECIALTY GAS AND CDA SYSTEMS
- 26. WASTE GAS ABATEMENT SYSTEMS
- 27. PFC ABATEMENT
- 28. CHEMICAL AND SLURRY HANDLING SYSTEMS
- 29. FLUID HANDLING COMPONENTS FOR HIGH-PURITY LIQUID CHEMICALS AND SLURRIES
- 30. FUNDAMENTALS OF ULTRAPURE WATER
- 31. YIELD MANAGEMENT
- 32. AUTOMATED MATERIAL HANDLING SYSTEM
- 33. CD METROLOGY AND CD-SEM
- 34. SIX SIGMA
- 35. ADVANCED PROCESS CONTROL
- 36. ENVIRONMENTAL, HEALTH, AND SAFETY CONSIDERATIONS IN SEMICONDUCTOR FABRICATION FACILITIES
- 37. PLAN, DESIGN, AND CONSTRUCTION OF A FAB
-
38.
CLEANROOM DESIGN AND CONSTRUCTION
- INTRODUCTION
- CLEANROOM STANDARDS, CLASSIFICATIONS, AND CERTIFICATION
- TYPES OF CLEANROOM
- AIRFLOW LAYOUTS AND PATTERNS
- AIR CHANGES
- ELEMENTS OF A CLEANROOM
- ENVIRONMENTAL CONDITIONAL REQUIREMENTS
- PROCESS CONTAMINATION CONTROL
- VIBRATION AND NOISE CONTROL
- MAGNETIC AND ELECTROMAGNETIC FLUX
- ELECTROSTATIC CHARGE OF AIR AND SURFACES
- LIFE SAFETY
- COMPUTATIONAL FLUID DYNAMICS
- CLEANROOM ECONOMICS
- PRACTICAL PROBLEMS AND SOLUTIONS SAMPLES
-
39.
MICRO-VIBRATION AND NOISE DESIGN
- INTRODUCTION
- MEASUREMENT METHODOLOGY AND CRITERIA
- VIBRATION AND NOISE SOURCES
- FOUNDATION AND STRUCTURAL DESIGN
- VIBRATION AND NOISE CONTROL IN THE MECHANICAL/ ELECTRICAL/PROCESS (MEP) DESIGN
- ACOUSTIC DESIGN
- TOOL HOOK-UP
- PURPOSES AND TIMING OF FACILITY VIBRATION SURVEYS
- MATURATION OF THE VIBRATION AND NOISE ENVIRONMENT
- FUTURE TRENDS AND SPECIAL CASES
- ACKNOWLEDGMENTS
- 40. ESD CONTROLS IN CLEANROOM ENVIRONMENTS
-
41.
AIRBORNE MOLECULAR CONTAMINATION
- INTRODUCTION TO CHEMICAL CONTAMINATION AND DEFINITION OF AMC
- CLASSIFICATION OF AMC
- AMC CONTROL CONSIDERATIONS
- IMPLEMENTING AMC CONTROL
- GAS-PHASE AIR FILTRATION PRINCIPLES
- DRY-SCRUBBING AIR FILTRATION MEDIA
- CHEMICAL FILTRATION EQUIPMENT DESIGNS
- AMC MONITORING
- AMC CONTROL APPLICATION AREAS
- AMC CONTROL SPECIFICATIONS AND STANDARDS
- SPECIFYING AN AMC CONTROL SYSTEM
- FINAL CONSIDERATIONS
- SUMMARY
- 42. PARTICLE MONITORING IN SEMICONDUCTOR MANUFACTURING
- 43. WASTEWATER NEUTRALIZATION SYSTEMS
-
A.
APPENDIX
-
B.
ABOUT THE EDITOR
Book Details
Title: Semiconductor Manufacturing Handbook
Publisher: McGRAW-HILL: New York, Chicago, San Francisco, Lisbon, London, Madrid, Mexico City, Milan, New Delhi, San Juan, Seoul, Singapore, Sydney, Toronto
Copyright / Pub. Date: 2005 The McGraw-Hill Companies, Inc.
ISBN: 9780071445597
Authors:
Hwaiyu Geng
CMfgE, P.E. (Palo Alto, California) is a Project Manager of Corporate REWS at Hewlett-Packard
Company. His experience in manufacturing engineering is diverse, including work at
Applied Materials and Hewlett-Packard’s high-tech industries. He has faced many of
the challenges facing engineers today, having designed manufacturing processes and
facilities for new products, implemented automated manufacturing systems, and established
quality, safety, and maintenance programs. He is a Certified Manufacturing Engineer
by the Society of Manufacturing Engineers and a Professional Engineer in the State
of California. Mr. Geng is also the author of McGraw-Hill’s Manufacturing Engineering
Handbook.
Description: This handbook will provide engineers with the principles, applications, and solutions needed to design and manage semiconductor manufacturing operations. Consolidating the many complex fields of semiconductor fundamentals and manufacturing into one volume by deploying a team of world class specialists, it allows the quick look up of specific manufacturing reference data across many subdisciplines.
Required field
