System on Package: Miniaturization of the Entire System
by: Rao R. Tummala
Abstract: System-on-Package (SOP) is an emerging microelectronic technology that places an entire system on a single chip-size package. Where “systems" used to be bulky boxes housing hundreds of components, SOP saves interconnection time and heat generation by keep a full system with computing, communications, and consumer functions all in a single chip. Written by the Georgia Tech developers of the technology, this book explains the basic parameters, design functions, and manufacturing issues, showing electronic designers how this radical new packaging technology can be used to solve pressing electronics design challenges.
Full details
Table of Contents
- A. About the Authors
- B. Foreword
- C. Preface
- 1. Introduction to the System-on-Package (SOP) Technology
- 2. Introduction to System-on-Chip (SOC)
- 3. Stacked ICs and Packages (SIP)
- 4. Mixed-Signal (SOP) Design
- 5. Radio Frequency System-on-Package (RF SOP)
- 6. Integrated Chip-to-Chip Optoelectronic SOP
- 7. SOP Substrate with Multilayer Wiring and Thin-Film Embedded Components
- 8. Mixed-Signal (SOP) Reliability
- 9. MEMS Packaging
- 10. Wafer-Level SOP
- 11. Thermal SOP
- 12. Electrical Test of SOP Modules and Systems
- 13. Biosensor SOP
Tools & Media
Expanded Table of Contents
-
A.
About the Authors
-
B.
Foreword
-
C.
Preface
-
1.
Introduction to the System-on-Package (SOP) Technology
- Introduction
- Electronic System Trend to Digital Convergence
- Building Blocks of an Electronic System
- System Technologies Evolution
- Five Major System Technologies
- System-on-Package Technology (Module with the Best of IC and System Integration)
- Comparison of the Five System Technologies
- Status of SOP around the Globe
- SOP Technology Implementations
- SOP Technologies
- Summary
- Acknowledgments
- 2. Introduction to System-on-Chip (SOC)
- 3. Stacked ICs and Packages (SIP)
- 4. Mixed-Signal (SOP) Design
- 5. Radio Frequency System-on-Package (RF SOP)
-
6.
Integrated Chip-to-Chip Optoelectronic SOP
- Introduction
- Applications of Optoelectronic SOP
- Integration Challenges in Thin-Film Optoelectronic SOP
- Advantages of Optoelectronic SOP
- Evolution of Optoelectronic SOP Technology
- Optoelectronic SOP Thin-Film Components
- SOP Integration: Interface Optical Coupling
- On-Chip Optical Circuits
- Future Trends in Optoelectronic SOP
- Summary
- 7. SOP Substrate with Multilayer Wiring and Thin-Film Embedded Components
- 8. Mixed-Signal (SOP) Reliability
- 9. MEMS Packaging
- 10. Wafer-Level SOP
- 11. Thermal SOP
- 12. Electrical Test of SOP Modules and Systems
- 13. Biosensor SOP
Book Details
Title: System on Package: Miniaturization of the Entire System
Publisher: : New York, Chicago, San Francisco, Lisbon, London, Madrid, Mexico City, Milan, New Delhi, San Juan, Seoul, Singapore, Sydney, Toronto
Copyright / Pub. Date: 2008 The McGraw-Hill Companies, Inc.
ISBN: 9780071459068
Authors:
Rao R. Tummala
(Atlanta, GA) is Pettit Chair Professor and Director of the Packaging Research Center
at Georgia Tech. He is a past-President of ISHM, an IEEE Fellow, and the General Chair
of IEEE-ICTC. He was recently named by Industry Week as one of the 50 Stars in the
US for improving national competitiveness.
Description: System-on-Package (SOP) is an emerging microelectronic technology that places an entire system on a single chip-size package. Where “systems" used to be bulky boxes housing hundreds of components, SOP saves interconnection time and heat generation by keep a full system with computing, communications, and consumer functions all in a single chip. Written by the Georgia Tech developers of the technology, this book explains the basic parameters, design functions, and manufacturing issues, showing electronic designers how this radical new packaging technology can be used to solve pressing electronics design challenges.
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