Wire Bonding in Microelectronics, Third Edition
by: George Harman
Abstract: The definitive resource on the critical process of connecting semiconductors with their packages. Wire Bonding in Microelectronics, Third Edition, has been thoroughly revised to help you meet the challenges of today’s small-scale and fine-pitch microelectronics. This authoritative guide covers every aspect of designing, manufacturing, and evaluating wire bonds engineered with cutting-edge techniques. In addition to gaining a full grasp of bonding technology, you’ll learn how to create reliable bonds at exceedingly high yields, test wire bonds, solve common bonding problems, implement molecular cleaning methods, and much more.
Full details
Table of Contents
- A. About the Author
- B. Introduction to Third Edition
- C. Acknowledgments
- 1. The Technical Introduction to the Third Edition
- 2. Ultrasonic Bonding Systems and Technologies, Including a Description of the Ultrasonic Wire Bonding Mechanism
- 3. Bonding Wire Metallurgy and Characteristics That Can Affect Bonding, Reliability, or Testing
- 4. Wire Bond Testing
- 5. Gold-Aluminum Intermetallic Compounds and Other Metallic Interface Reactions in Wire Bonding
- 6. Introduction to Plating, Section A (Gold) and Section B (Nickel-Based) Bond Pad Technology and Reliability
- 7. Cleaning to Improve Bondability and Reliability
- 8. Mechanical Problems in Wire Bonding
- 9. Advanced and Specialized Wire Bonding Technologies
- 10. An Overview of the Materials and Material Science of Copper, Low-k Devices That Affect Bonding and Packaging
- 11. Wire Bonding Process Modeling and Simulation
- A. Glossary
- B. Bibliography
Tools & Media
Expanded Table of Contents
-
A.
About the Author
-
B.
Introduction to Third Edition
-
C.
Acknowledgments
- 1. The Technical Introduction to the Third Edition
-
2.
Ultrasonic Bonding Systems and Technologies, Including a Description of the Ultrasonic
Wire Bonding Mechanism
- Introduction
- Ultrasonic Transducer and Tool Vibration Modes
- How Ultrasonic Bonds Are Made (Empirical Description)
- Bonding with High(er) Frequency Ultrasonic Energy
- In-Process (Real-Time) Bond Monitoring
- Wire-Bonding Technologies
- Variations of Fine-Wire Bonding Technology
- Major Chip Interconnection Alternatives to Wire Bonding (Flip Chip and TAB)
- Wire-Bonding Technology: A Comparison and Future Directions
-
3.
Bonding Wire Metallurgy and Characteristics That Can Affect Bonding, Reliability,
or Testing
- Introduction
- Stress-Strain Characteristics of Bonding Wires
- The Shelf-Life Aging of Bonding Wires
- General Discussion of Gold Bonding Wire
- Aluminum Wire for Ultrasonic Wedge Bonding
- Wire and Metallization Hardness
- The Effect of EFO Polarity on Gold Wire and Its Metallurgy
- Metallurgical Fatigue of Bonding Wires
- Copper Wire for Ball Bonding
- Conductor Burn Out (Fusing)
- Conclusion
-
4.
Wire Bond Testing
- Introduction
- The Destructive Bond Pull Test
- Ball-Bond Shear Test
- Evaluating Both the Ball and the Wedge Bond on a Single Wire
- Thermal Stress Test for Au-Al Wire Bond Reliability
- Future Issues in Wire Bond Testing
- Typical Failure Modes of the Ball-Shear Test (Failure Mode 2 Is the Normal Desired Test Result)
- The Nondestructive Bond Pull Test
- 5. Gold-Aluminum Intermetallic Compounds and Other Metallic Interface Reactions in Wire Bonding
- 6. Introduction to Plating, Section A (Gold) and Section B (Nickel-Based) Bond Pad Technology and Reliability
- 7. Cleaning to Improve Bondability and Reliability
-
8.
Mechanical Problems in Wire Bonding
- Cratering
- Cracks in the Heels of Ultrasonic Wedge Bonds
- The Effect of Acceleration, Vibrations, and Shock on Open-Cavity Packages
- Effects of Power and Temperature Cycling of Wire Bonds
- Fracture Toughness Defined Fracture Toughness is the Stress Required to Extend an Existing Crack
- Design of Experiments (DOE) for Wire Bonder Setup
- 9. Advanced and Specialized Wire Bonding Technologies
- 10. An Overview of the Materials and Material Science of Copper, Low-k Devices That Affect Bonding and Packaging
-
11.
Wire Bonding Process Modeling and Simulation
- Introduction
- Assumption, Material Properties, and Method of Analysis
- Wire Bonding Process with Different Parameters [ 11-10]
- Comparison of the Impacts between Wire Bonding and Wafer Probing for a Bond Pad Over Active (BPOA) Device [ 11-19, 11-20]
- Wire Bonding above a Laminate Substrate [ 11-8]
- Acknowledgments
-
A.
Glossary
-
B.
Bibliography
Book Details
Title: Wire Bonding in Microelectronics, Third Edition
Publisher: : New York, Chicago, San Francisco, Lisbon, London, Madrid, Mexico City, Milan, New Delhi, San Juan, Seoul, Singapore, Sydney, Toronto
Copyright / Pub. Date: 2010, 1997, 1989 The McGraw-Hill Companies, Inc.
ISBN: 9780071701013
Authors:
George Harman
Harman is a Fellow of the National Institute of Standards and Technology’s Semiconductor
Electronics Division.
Description: The definitive resource on the critical process of connecting semiconductors with their packages. Wire Bonding in Microelectronics, Third Edition, has been thoroughly revised to help you meet the challenges of today’s small-scale and fine-pitch microelectronics. This authoritative guide covers every aspect of designing, manufacturing, and evaluating wire bonds engineered with cutting-edge techniques. In addition to gaining a full grasp of bonding technology, you’ll learn how to create reliable bonds at exceedingly high yields, test wire bonds, solve common bonding problems, implement molecular cleaning methods, and much more.
Required field
